发明名称 |
Conductive paste and wiring board using it |
摘要 |
A conductive paste mainly composed of a metal powder, a glass frit, and an organic vehicle. The total content amount of the metal powder and glass frit with respect to the entire conductive paste is 85 wt % or more. The viscosity at a rotational speed of 1 rpm measured at 25° C. with an E type rotating viscometer is 100 Pa·s or more and 400 Pa·s or less.
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申请公布号 |
US8007690(B2) |
申请公布日期 |
2011.08.30 |
申请号 |
US20060887835 |
申请日期 |
2006.05.22 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
YAMAKAWA MASAHIRO;SHIMODA KOHEI |
分类号 |
H01B1/22 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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