发明名称 Conductive paste and wiring board using it
摘要 A conductive paste mainly composed of a metal powder, a glass frit, and an organic vehicle. The total content amount of the metal powder and glass frit with respect to the entire conductive paste is 85 wt % or more. The viscosity at a rotational speed of 1 rpm measured at 25° C. with an E type rotating viscometer is 100 Pa·s or more and 400 Pa·s or less.
申请公布号 US8007690(B2) 申请公布日期 2011.08.30
申请号 US20060887835 申请日期 2006.05.22
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 YAMAKAWA MASAHIRO;SHIMODA KOHEI
分类号 H01B1/22 主分类号 H01B1/22
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