发明名称 Wireless IC device
摘要 An article package formed from, for example, an aluminum-evaporated laminated film includes a cut-out section, which has no aluminum-evaporated layer, in an edge. An electromagnetic-coupling module is disposed in the cut-out section. A wireless IC device is constituted by the electromagnetic-coupling module and an aluminum-evaporated layer of the package. A magnetic-field antenna of the electromagnetic-coupling module is coupled to the aluminum-evaporated layer of the package. The whole of the article package acts as a radiator of the antenna.
申请公布号 US8006910(B2) 申请公布日期 2011.08.30
申请号 US20100789610 申请日期 2010.05.28
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KATO NOBORU
分类号 G06K19/06 主分类号 G06K19/06
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