THERMAL TRANSPORT DEVICE PRODUCING METHOD AND THERMAL TRANSPORT DEVICE

摘要

[Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding. [Solving Means] A bonding surface (1a) of an upper member (1) that is subjected to diffusion bonding to a bonding surface (21) of a frame member (2) is formed into a convex shape, which can make a contact area of the bonding surface (1a) and the bonding surface (21) small. Therefore, a pressure (load per unit area) applied to the bonding surfaces (1a and 21) is increased, and thus the diffusion bonding of the bonding surfaces (1a and 21) is performed by a high pressure. Similarly, a bonding surface (3a) of a lower member (3) and a bonding surface (23) of the frame member (2) are also subjected to the diffusion bonding by a high pressure. As a result, a heat transport device (100) having a high hermeticity can be manufactured without increasing an entire load (F) applied at the time of the diffusion bonding.