| 摘要 |
<p>Disclosed is a curable hysteretic silicone gel-forming composition comprising: (A) at least one substantially resinous organopolysiloxane containing at least two silicon-bonded alkenyl groups per molecule; (B) at least one organohydrogenpolysiloxane containing at least two silicon bonded hydrogen atoms per molecule, said organohydrogenpolysiloxane (B) being used in an amount such that the mole ratio of total amount of silicon-bonded hydrogen atoms contained in organohydrogenpolysiloxane (B) to silicon-bonded alkenyl groups contained in organopolysiloxane (A) is of from about 0.20 to about 0.79; (C) filler in an amount of from about 33 to about 70 parts per hundred of organopolysiloxane (A), wherein the filler has a particle size of from about 5 nanometers to about 200 nanometers; (D) catalyst; and, (E) inhibitor in an amount of from about 0.05 to about 1 weight percent, where polyorganosiloxane (A) is substantially resinous polyorganosiloxane and comprises, no less than about 30 weight percent of T and/or Q units, based upon the weight of substantially resinous polyorganosiloxane, where T=R6SiO3/2 and Q=Si04/2 , where R6 is selected from the group consisting of a monovalent hydrocarbon radical of from one to about sixty carbon atoms; an unsaturated monovalent hydrocarbon radical containing from 2 to 10 carbon atoms; and combinations thereof, provided that polyorganosiloxane (A) contains at least two silicon-bonded alkenyl groups per molecule. Also disclosed are silicone gels formed by heating said composition.</p> |
