发明名称 |
hBN INSULATOR LAYERS AND ASSOCIATED METHODS |
摘要 |
Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided including a substrate and an electrically insulating layer coated on at least one surface of the substrate, the electrically insulating layer including a plurality of hBN particles bound in a binder material. |
申请公布号 |
US2011204409(A1) |
申请公布日期 |
2011.08.25 |
申请号 |
US201113014105 |
申请日期 |
2011.01.26 |
申请人 |
SUNG CHIEN-MIN;HU SHAO CHUNG;TENG CHIEN-CHUNG;YANG SHANG-RAY;SUNG MICHAEL |
发明人 |
SUNG CHIEN-MIN;HU SHAO CHUNG;TENG CHIEN-CHUNG;YANG SHANG-RAY;SUNG MICHAEL |
分类号 |
H01L33/64;C09K5/08;F28F7/00;H05K1/00;H05K1/03;H05K7/20 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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