| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive for circuit-member connection that allows alignment marks attached to a wafer to be highly recognizable in an uncured state and achieves excellent connection reliability when a semiconductor device is manufactured and a high-temperature and high-humidity test and a temperature cycle test are executed to the semiconductor device, and a semiconductor device using the same. <P>SOLUTION: The adhesive for circuit-member connection contains a phenol-based compound having a phenolic hydroxyl group, a thermosetting resin, a thermoplastic resin, and a curing agent for a thermosetting resin. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
