发明名称 Method Of Forming Pattern Structure And Method Of Fabricating Semiconductor Device Using The Same
摘要 A method of forming a pattern structure and a method of fabricating a semiconductor device using the pattern structure, are provided the method of forming the pattern structure includes forming a mask on an underlying layer formed on a lower layer. The underlying layer is etched using the mask as an etching mask, thereby forming patterns on the lower layer. The patterns define at least one opening. A sacrificial layer is formed in the opening and the mask is removed. The sacrificial layer in the opening is partially etched when the mask is removed.
申请公布号 US2011207285(A1) 申请公布日期 2011.08.25
申请号 US201113029449 申请日期 2011.02.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM JUNG-IN;OH JAEHEE;SUH KISEOK
分类号 H01L21/02;H01L21/027 主分类号 H01L21/02
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