发明名称 Temperature Compensated Surface Acoustic Wave Device and Method Having Buried Interdigital Transducers for Providing an Improved Insertion Loss and Quality Factor
摘要 A SAW device having metal electrodes on a surface of the piezoelectric substrate includes a dielectric layer deposited on the surface. Depositing the layer results in seams extending upward from the electrodes extending above the surface of the substrate. An additional seam results from one seam extending from one electrode joining a second seam extending from an adjacent electrode within the dielectric layer and is generally formed above the height of the electrodes. The additional seam is removed through planarization or the like. The dielectric layer may be further planarized for providing a thickness of the dielectric layer above the electrodes as desired.
申请公布号 US2011204747(A1) 申请公布日期 2011.08.25
申请号 US20100709772 申请日期 2010.02.22
申请人 TRIQUINT SEMICONDUCTOR, INC. 发明人 CHEN ALAN S.;KOOK TAEHO;STEINER KURT G.;NESTON STEPHEN A.;DANIEL TIMOTHY J.
分类号 H01L41/04;B32B37/02;B32B38/10 主分类号 H01L41/04
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