| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board wherein the improvement in connection with mounted electronic components is achieved. SOLUTION: In the wiring board wherein a connection pad 38 and wiring layers 18a to 18c formed by plating, and insulating layers 20, 20a, 20b formed of resin are stacked, the connection pad 38 is provided in the insulating layer 20 of the outermost layer and is exposed to the surface of the insulating layer 20 of the outermost layer. It has a curved first surface 38a which is hollowed from the surface and a second surface which is in the opposite side of the first surface 38a. The insulating layer has a via hole 20X which exposes the second surface of the connection pad 38. The wiring layer 18a is constituted of a seed layer formed in a surface opposite to an inside of the via hole 20X and the surface of the insulating layer 20 of the outermost layer, and a copper plated layer formed on the seed layer. It is connected to the second surface in the insulating layer 20 of the outermost layer. COPYRIGHT: (C)2011,JPO&INPIT |
