| 摘要 |
PROBLEM TO BE SOLVED: To provide a pretreatment liquid to be used for a wet method for imparting a plating film having high adhesiveness to a low-coarsened surface without performing any adhesiveness promoting pretreatment or forming any metal film by a dry method in metal plating on a resin base body in which the resin base material, glass material or the like are mixed, and to provide a surface treatment method using the pretreatment liquid, a metal plating film forming method, and a method for manufacturing a printed circuit board. SOLUTION: The pretreatment liquid is a conditioner to be used for the pretreatment liquid for performing the electroless plating on a surface of a resin base body, and contains cation polymer, water and bifluoride salt of 5-200 g/L. COPYRIGHT: (C)2011,JPO&INPIT
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