| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED module which has high durability and is reduced in cost. <P>SOLUTION: The LED module 1 is provided with: a board; an interconnection 22 formed on an upper surface of the board; and an LED package 14 mounted on the board. The LED package 14 is provided with: lead frames 101 and 103 disposed on the same plane to be apart from each other, and connected to portions of the interconnection 22 insulated from each other; an LED chip 104 provided above the lead frames, having one terminal connected to the lead frame 101, and having another terminal connected to the lead frame 103; and a transparent resin body 107 covering the entire upper surface, a part of a lower surface, and a part of an edge face of each of the lead frames 101 and 103, embedding the LED chip 104, and exposing the remaining part of the lower surface and the remaining part of the edge face of each of the lead frames 101 and 103. <P>COPYRIGHT: (C)2011,JPO&INPIT |
