| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the warpage of a semiconductor wafer caused by the contraction stress of a sealing film. <P>SOLUTION: Several external connection electrodes 17 are formed on the semiconductor wafer 1 which has several connection pads 3. Sealing resin layers 21 are formed between the external connection electrodes 17. Sheet-like sealing members having openings 23 through which the external connection electrodes 17 pass are arranged in the sealing resin layers 21. The sealing resin layers 21 are hardened. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
