发明名称 CUTTING APPARATUS FOR THE PLATE DEVICE
摘要 PURPOSE: A cutting apparatus of a substrate member is provided to improve the productivity of cutting process using automated equipment. CONSTITUTION: A substrate supplier(1) grips a substrate member from loaded substrate members and transmits. A half cutting part(2) forms a cutting groove(21) which shines laser to the delivered substrate member from the substrate supplier. A braking part(3) cuts the substrate member according to the cutting groove. A controller controls successive operation of the substrate supplier, the half cutting part, and the braking part. A plurality of inhaling holes which inhales air is formed the surface of the braking part.
申请公布号 KR101058073(B1) 申请公布日期 2011.08.25
申请号 KR20110020644 申请日期 2011.03.08
申请人 JCOBS CO., LTD.;S-ENERGY CO., LTD. 发明人 HONG, JIN HYUN;KIM, DAE JOONG;KIM, IL HWAN;PARK, IN KYU;SHIN, HAN CHUL
分类号 H01L31/18;B23K26/38;H01L31/042 主分类号 H01L31/18
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