| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in in-plane uniformity of film thickness when coating, and in storage stability, a method for manufacturing a cured relief pattern and a semiconductor device. <P>SOLUTION: The photosensitive resin composition contains 100 pts.mass of an alkali-soluble resin (A) containing a resin having one or more kinds of structures selected from a group consisting of a polyimide structure, a polybenzoxazole structure, a polyimide precursor structure and a polybenzoxazole precursor structure, 10-1,000 pts.mass of a solvent (B) containing at least one kind of compound selected from a group consisting of compounds represented by tetrahydrofurfuryl alcohol, furfural and furan carboxylic acid alkyl ester, and 0.1-100 pts.mass of a photosensitizing agent (C). <P>COPYRIGHT: (C)2011,JPO&INPIT |
