| 发明名称 |
LEAD-FREE SOLDER ALLOY HAVING REDUCED SHRINKAGE CAVITIES |
| 摘要 |
A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.
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| 申请公布号 |
US2011204121(A1) |
申请公布日期 |
2011.08.25 |
| 申请号 |
US20090736625 |
申请日期 |
2009.04.23 |
| 申请人 |
KAWAMATA YUJI;UESHIMA MINORU;KANG MIN;NAKAGAWA KAYAKO;KOKUBU YASUAKI |
发明人 |
KAWAMATA YUJI;UESHIMA MINORU;KANG MIN;NAKAGAWA KAYAKO;KOKUBU YASUAKI |
| 分类号 |
B23K1/00;B23K35/24;C22C13/02 |
主分类号 |
B23K1/00 |
| 代理机构 |
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