| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a high heat dissipation performance from a functional element. <P>SOLUTION: The semiconductor device 100 includes the functional element 140, a metal substrate (heat conductive substrate) 101 on which the functional element is mounted in the mounting region 130 which is part of the surface, and a single layer or multiple layers of wiring layer 110 formed in a wiring layer region 125 which is the region on the surface of the metal substrate except for the mounting region. The surface of the functional element opposite to the metal substrate is lower than the surface opposite to the metal substrate of the wiring layer. The metal substrate is composed of a metal material and the functional element is a plurality of semiconductor elements junctioned to the surface of the metal substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
