| 发明名称 |
SIDE EMITTING SEMICONDUCTOR PACKAGE |
| 摘要 |
A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.
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| 申请公布号 |
US2011206079(A1) |
申请公布日期 |
2011.08.25 |
| 申请号 |
US20100900676 |
申请日期 |
2010.10.08 |
| 申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
HSIEH MIN-TSUN;TSENG WEN-LIANG;CHEN LUNG-HSIN;LIN CHIH-YUNG |
| 分类号 |
H01S5/02;H01L33/48 |
主分类号 |
H01S5/02 |
| 代理机构 |
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