发明名称 RESIN COMPOSITION FOR INJECTION MOLDING, MOLDED ARTICLE, MANUFACTURING METHOD THEREFOR, AND BOX BODY FOR ELECTRIC/ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for injection molding being excellent in molding processability (flowing characteristic) and being excellent in a viewpoint of rigidity (flexural modulus), water content and evapotranspiration. SOLUTION: The resin composition for injection molding contains an imide based compound represented by formula (I), a flame-retardant and a cellulose ester based resin. Wherein R<SP>1</SP>and R<SP>2</SP>each independently represents a divalent aliphatic hydrocarbon group or a divalent aromatic hydrocarbon group, and L represents a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group and a divalent group obtained by combining the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011162697(A) 申请公布日期 2011.08.25
申请号 JP20100028263 申请日期 2010.02.10
申请人 FUJIFILM CORP 发明人 INADA HIROSHI
分类号 C08L1/08;B29C45/00;C08K3/32;C08K5/3415;C08K5/51 主分类号 C08L1/08
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