发明名称 SUBSTRATE SUCKING DEVICE, AND SUBSTRATE SUCKING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate sucking device that holds constant a holding state of a substrate sucked by a suction head and a suction pad. SOLUTION: The substrate sucking device includes the suction head 2 and the suction pad 3 mounted on a tip outer peripheral part of the suction head 2 and elastically displaced, and configures to suck the substrate 15 by those suction head 2 and suction pad 3. In the substrate sucking device, a suction surface 10 of the suction pad 3 protrudes forward from a tip surface 12 of the suction head 2. When the suction head 3 bends through vacuuming, the substrate 15 comes in contact with the tip surface 12 of the suction head 2. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011165850(A) 申请公布日期 2011.08.25
申请号 JP20100026354 申请日期 2010.02.09
申请人 FUJIKURA LTD 发明人 ONISHI TAKASHI
分类号 H05K3/00;H05K1/02 主分类号 H05K3/00
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