| 摘要 |
A method of initiating molecular bonding, comprising bringing one face of a first wafer to face one face of a second wafer and initiating a point of contact between the two facing faces. The point of contact is initiated by application to one of the two wafers, for example, using a bearing element of a tool, of a mechanical pressure in the range from 0.1 MPa to 33.3 MPa.
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