发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat-sensitive adhesive having strong adhesive strength to a rough surface adherend such as corrugated cardboard, and a polyolefin wrap film, hardly causing deterioration of the adhesive strength with time, capable of being thermally activated with a low energy, and having good blocking resistance; and to provide a heat-sensitive adhesive material. <P>SOLUTION: The heat-sensitive adhesive contains at least a thermoplastic resin and a hot-melt material which contains at least one kind of a compound represented by structural formula (I) and a compound represented by general formula (II), (In the formulas, R<SP>1</SP>is a hydrogen atom or an alkyl group; and n is an integer of 1-5). <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP4755435(B2) 申请公布日期 2011.08.24
申请号 JP20050078509 申请日期 2005.03.18
申请人 发明人
分类号 C09J201/00;B41J2/01;B41M5/00;B41M5/28;B41M5/30;B41M5/382;B41M5/40;B41M5/50;B41M5/52;C09J7/02;C09J11/06;G03G7/00 主分类号 C09J201/00
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