| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip-chip light emitting diode high in adhesion force between an electrode and a protection film to suppress peeling on an interface between them. <P>SOLUTION: The flip-chip light emitting diode 1 that includes the first and second electrodes 4, 5 at least whose upper surfaces are made of a metal, an insulating protection film 16 covering the first and second electrodes 4, 5, and adhesion layers 15 disposed between the first and second electrodes 4, 5 and the protection film 16, and wherein upper surfaces of the first and second electrodes 4, 5 are partially or entirely exposed from an opening 17 passing through the protection film 16 and the adhesion layer 15, is selected. <P>COPYRIGHT: (C)2011,JPO&INPIT |
