| 摘要 |
<p>The present invention has its object to provide a thermally expandable microcapsule, which shows excellent heat resistance and a high expansion ratio and thereby can be suitably used for molding processes involving high shearing force,such as kneading molding, calender molding, extrusion molding, and injection molding. The present invention also has its object to provide a foamed product using the thermally expandable microcapsule. The present invention relates to a thermally expandable microcapsule, which comprises: a shell made of a polymer; and a volatile expansion agent as a core agent encapsulated in the shell, the storage elastic modulus (E') of the shell at a temperature of 200°C and a frequency of 10 Hz being 1 × 10 5 N/m 2 or more, the storage elastic modulus (E') of the shell at a temperature of 250°C and a frequency of 10 Hz being 1 × 10 5 N/m 2 or more, and a maximum displacement amount measured by thermomechanical analysis being 300 µm or more.</p> |
