| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can reduce warpage and deformation by face-down bonding a thin semiconductor chip to a flexible circuit board by using a thermosetting resin. <P>SOLUTION: A bonding resin 4 is cured in a state where part of a semiconductor substrate located in the center of the semiconductor chip 1 is flexed to the opposite side. The circuit board 3 is sucked to a bonding stage 5 having a recess 6 and flexed by being pulled into the evacuated recess 6. Since the flexure of the circuit board 3 decreases as a bonding resin shrinks at the time of curing or cooling and bending stress applied to the circuit board 3 or the like through shrinkage is offset, thereby reducing the warpage of the semiconductor device. <P>COPYRIGHT: (C)2009,JPO&INPIT |
