Device and method for deposing a layer composed of at least two components on a substrate

摘要

The apparatus (10) for depositing a thin layer consisting of two components on an object such as a substrate (20), comprises a deposition chamber (11), in which the object is arrangeable, a source (12) with a material to be deposited, where the source is arranged or arrangeable in the deposition chamber, and a device (40) for controlling the deposition process, where the controlling device is designed such that the concentration of one component of the material to be deposited is changed by the controlling device in its gas phase and before its deposition on the substrate. The apparatus (10) for depositing a thin layer consisting of two components on an object such as a substrate (20), comprises a deposition chamber (11), in which the object is arrangeable, a source (12) with a material to be deposited, where the source is arranged or arrangeable in the deposition chamber, and a device (40) for controlling the deposition process, where the controlling device is designed such that the concentration of one component of the material to be deposited is changed by the controlling device in its gas phase and before its deposition on the substrate by selectively binding a determined quantity of the component, so that the deposition takes place in a controlled manner. The controlling device has two getter elements, which are made of a reactive material and/or an inert material, are arranged in the deposition chamber and are designed, so that the concentration of the components is changeable by chemical binding and/or physical binding of the determined quantity of the components on the getter element. The getter element is arranged as a explicit element in the deposition chamber and/or a part of the deposition chamber forms a part of a deposition chamber wall. The controlling device includes a cover element that is designed so that an active area of the getter element is variable. The controlling device has a device for temperature control and/or temperature regulation, where the temperature control and/or temperature regulation device is designed such that the temperature of the active area of the getter element and/or the substrate is controllable. The getter elements are formed as electrode elements, to which different electrical potentials are applied, so that two differently formed getter elements are provided. The controlling device is designed, so that a different electrical potential is applied to the getter element in relation to the deposition chamber wall. The controlling device has an electrode and is designed, so that the different electrical potential is applied to the getter element in relation to the electrode. The controlling device includes a device for processing and/or positioning the getter elements and/or cover elements, where the processing and/or positioning device is designed such that the getter elements and/or the cover elements are processable in the deposition chamber and the position of the getter element and/or the cover element is variable. The getter element is formed as a surface element or a rod element and/or as a grid element, and is designed so that it covers the source in a partial manner. An independent claim is included for a method for depositing a thin layer consisting of two components on an object such as a substrate.