| 摘要 |
A waterborne thermoset cured anticorrosion formulation includes a water dispersed or emulsified phosphonated or water dispersed or emulsified sulfonated epoxy resin that is cured with a phenoxy resin having a polyhydroxyl ether backbone and terminal alpha glycol moieties. Water is present as a predominant volatile in which the epoxy resin and phenoxy resin are present in a weight ratio of epoxy resin to phenoxy resin of between 0.1 and 3:1. An aqueous curative is provided to induce cure between the epoxy resin and phenoxy resin. A corrosion inhibiting metal salt is also present having a salt anion of phosphate, biphosphate or tetraborate and a metal cation with the proviso that the metal cation formulation as a whole is devoid of chromium, lead, cobalt, and cadmium. Ideal curatives include aqueous aminoplast crosslinkers, aqueous unblocked isocyanates, aqueous blocked isocyanates, and a mixture thereof. With the inclusion of electrically conductive aluminum or zinc particulate the formulation is rendered corrosion resistant as well as electrically conductive to make an inventive coating amenable to powder coating.
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