发明名称 MULTILAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate and a method of manufacturing the same. SOLUTION: The multilayer ceramic substrate includes a ceramic laminate 110 formed by laminating multiple ceramic layers by inter-layer connection through vias 120 each including a via hole 120a and a conductive material 120b charged in the via hole 120a, adhesion assisting layers 130 formed on inner walls of the via holes 120a, and pads 160a, 160b electrically connected to each other through the vias 120 and arranged on upper surfaces and lower surfaces of the ceramic laminate 110. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011159947(A) 申请公布日期 2011.08.18
申请号 JP20100180835 申请日期 2010.08.12
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM YOUNG SUK;LEE TAEK JUNG;CHANG BYEUNG GYU;OH YOUNG SOO
分类号 H05K3/46 主分类号 H05K3/46
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