| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate holder eliminating processing projections of a support plate to support an adhesive holding layer in a stable posture and define air circulation space, thereby preventing the support plate from being damaged, and to provide a method of manufacturing the substrate holder. SOLUTION: The holder includes a support plate 1 and an adhesive holding layer 10 adhering to the surface of the support plate 1 to detachably hold a semiconductor wafer W. Air circulation space 13 is formed between the surface of the support plate 1 and the adhesive holding layer 10, and an exhaust hole 2 to exhaust air out of the air circulation space 13 to deform the adhesive holding layer 10 into an uneven shape is bored in the center of the support plate 1 in the thickness direction. By forming A plurality of uneven portions 12 on a to-be-adhered surface 11 of the adhesive holding layer 10 adhering to the flat surface of the support plate 1, the posture of the adhesive holding layer 10 is stabilized and the air circulation space 13 is defined. The formation of the uneven portions 12 on the to-be-adhered surface 11 of the adhesive holding layer 10 eliminates the need for forming multiple fine projections on the support plate 1. COPYRIGHT: (C)2011,JPO&INPIT |
