发明名称 LED PACKAGE AND A BACKLIGHT UNIT UNIT COMPRISING SAID LED PACKAGE
摘要 A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.
申请公布号 US2011199787(A1) 申请公布日期 2011.08.18
申请号 US200913002419 申请日期 2009.07.03
申请人 SAMSUNG LED CO., LTD. 发明人 KIM GEUN-YOUNG;ONISHI TOMOHISA;LEE JUNG-HUN;KIM YOUNG-TAEK;PARK JONG-JIN;YUN MI-JEONG;PARK YOUNG-SAM;HAHM HUN-JOO;KIM HYUNG-SUK;HAN SEONG-YEON;KIM DO-HUN;KIM DAE-YEON;KIM DAE-HYUN;PARK JUNG-KYU
分类号 F21V8/00;H01L33/62 主分类号 F21V8/00
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