发明名称 |
LED PACKAGE AND A BACKLIGHT UNIT UNIT COMPRISING SAID LED PACKAGE |
摘要 |
A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate. |
申请公布号 |
US2011199787(A1) |
申请公布日期 |
2011.08.18 |
申请号 |
US200913002419 |
申请日期 |
2009.07.03 |
申请人 |
SAMSUNG LED CO., LTD. |
发明人 |
KIM GEUN-YOUNG;ONISHI TOMOHISA;LEE JUNG-HUN;KIM YOUNG-TAEK;PARK JONG-JIN;YUN MI-JEONG;PARK YOUNG-SAM;HAHM HUN-JOO;KIM HYUNG-SUK;HAN SEONG-YEON;KIM DO-HUN;KIM DAE-YEON;KIM DAE-HYUN;PARK JUNG-KYU |
分类号 |
F21V8/00;H01L33/62 |
主分类号 |
F21V8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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