| 摘要 |
PURPOSE: A heat radiating structure for a heat radiating element is provided to effectively radiate heat from an electronic device by concentrating or reflecting heat from a heat radiating element to a heat sink or a case. CONSTITUTION: A printed circuit board(310) comprises a heat radiating element(300). A case(320) is installed on one side of the printed circuit board. The case transfers heat from the heat radiating element to a heat sink or outside. An infrared lens(330) refracts the heat to the heat sink or the case. The infrared lens is arranged on a path, to which heat from the heat radiating element is radiated. |
