| 摘要 |
The thermal management kit for high power of solid state light emitting diodes is invented to use the opened channel and/or hole of exiting luminaire and/or made a new hole and/or holes of upper luminaire and/or any part. The present invention utilize the hole in order to dissipative inside heat to outside of luminaire by using function of heat pipes by set up the heat pipe passes through opened channel and/or hole of luminaire.
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