| 摘要 |
PURPOSE: A light emitting device, a light emitting device manufacturing method, and a light emitting device package are provided to prevent static electricity damage by forming a capacitor in an LED chip, thereby minimizing reduction of light absorption. CONSTITUTION: A light emitting structure(110) includes a first conductive semiconductor layer(112), an active layer(114), and a second conductive semiconductor layer(116). A dielectric layer(132) is formed in a cavity of the light emitting structure. The dielectric layer contacts the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer. A second electrode layer(120) is formed under the dielectric layer. A first electrode(142) is formed on the dielectric layer. |
