发明名称 Heat Dissipation Apparatus for Data Center
摘要 The present invention discloses a heat dissipation apparatus that comprises at least a boiling houses, a condenser and an air channel. Each boiling house is provided to receive heat from at least a server, and is connected with a loop pipe filled with a first fluid. Each condenser is connected with the loop pipe so as to remove the heat from each boiling house. The cooling conduit is provided to receive a second fluid for conveying the second fluid to each condenser. The air channel is provided to receive a third fluid for transferring the heat from the condenser into a predetermined space.
申请公布号 US2011198060(A1) 申请公布日期 2011.08.18
申请号 US20100704963 申请日期 2010.02.12
申请人 LANGE TORBEN B;CHEN CHI-LIANG;HORSTMEYER ROBERT;PERSON JR GREER P;SENIOR ROBERT 发明人 LANGE TORBEN B.;CHEN CHI-LIANG;HORSTMEYER ROBERT;PERSON, JR. GREER P.;SENIOR ROBERT
分类号 F28D15/00 主分类号 F28D15/00
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