发明名称 |
Method and apparatus for safely dechucking wafers |
摘要 |
A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a sensor attached to the driving means for detecting a change in the variable quantity; and a controller for controlling the variable quantity to the driving means when a predetermined variable quantity is detected in comparison to the change in the variable quantity for a predetermined time.
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申请公布号 |
US8000081(B2) |
申请公布日期 |
2011.08.16 |
申请号 |
US20080172642 |
申请日期 |
2008.07.14 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LU CHUNG-TSUNG;SU PIN-CHIA;LIOU YU-CHIH |
分类号 |
H01L21/683;H01T23/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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