发明名称 Method and apparatus for safely dechucking wafers
摘要 A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a sensor attached to the driving means for detecting a change in the variable quantity; and a controller for controlling the variable quantity to the driving means when a predetermined variable quantity is detected in comparison to the change in the variable quantity for a predetermined time.
申请公布号 US8000081(B2) 申请公布日期 2011.08.16
申请号 US20080172642 申请日期 2008.07.14
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LU CHUNG-TSUNG;SU PIN-CHIA;LIOU YU-CHIH
分类号 H01L21/683;H01T23/00 主分类号 H01L21/683
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