发明名称 |
Pillar structure on bump pad |
摘要 |
Substrates including conductive pads for coupling the substrates to a microelectronic device and/or package are described herein. Embodiments of the present invention provide substrates comprising one or more conductive pads including a base portion and a pillar portion, the pillar portion being configured to couple with a microelectronic device. According to various embodiments of the present invention, the substrate may be a printed circuit board and/or may be a carrier substrate incorporated into an electronic package. The pillar portion may facilitate interconnection between the substrate and a microelectronic device or package by effectively raising the height of the conductive pad. Other embodiments may be described and claimed. |
申请公布号 |
US7999395(B1) |
申请公布日期 |
2011.08.16 |
申请号 |
US20100723085 |
申请日期 |
2010.03.12 |
申请人 |
MARVELL INTERNATIONAL LTD. |
发明人 |
KAO HUAHUNG;LIOU SHIANN-MING |
分类号 |
H01L23/52;H01L23/48;H01L23/485;H01L23/488;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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