| 摘要 |
A method of manufacturing a semiconductor device includes: forming a first resin layer on a wafer having a light receiving portion; patterning the first resin layer into a predetermined shape and forming a first resin film on the light receiving portion; dividing the wafer into light receiving elements; mounting the light receiving elements on an upper surface of a lead frame; a sealing step of forming a sealing resin layer around the first resin film; and removing the first resin film such that a portion of the light receiving element is exposed to the outside, and in the sealing step, the upper surface of the first resin film is flush with the upper surface of the sealing resin layer, or the upper surface of the first resin film is higher than the upper surface of the sealing resin layer.
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