| 摘要 |
THE INVENTION RELATES TO A DEVICE FOR ENCAPSULATING WITH ENCAPSULATING MATERIAL AN ELECTRONIC COMPONENT, IN PARTICULAR A SEMICONDUCTOR, FIXED ON A CARRIER, COMPRISING:TWO CO-ACTING MOULD PARTS WHICH ARE DISPLACEABLE RELATIVE TO EACH OTHER BETWEEN AN ENCAPSULATING POSITION, IN WHICH THE MOULD PARTS, WHEN CLOSING ONTO THE CARRIER, OCCUPY A POSITION FOR DEFINING AT LEAST ONE MOULD CAVITY, AND AN OPENED POSITION IN WHICH THE MOULD PARTS ARE SITUATED AT GREATER DISTANCE FROM EACH OTHER THAN IN THE ENCAPSULATING POSITION, AND FEED MEANS FOR ENCAPSULATING MATERIAL CONNECTING ONTO THE MOULD CAVITY.THE INVENTION ALSO RELATES TO A METHOD FOR ENCAPSULATING WITH ENCAPSULATING MATERIAL AN ELECTRONIC COMPONENT FIXED ON A CARRIER. |
