发明名称 |
HALBLEITERANORDNUNG MIT EINER MEHRFACH-CHIP- UMVERDRAHTUNGSSCHICHT |
摘要 |
A semiconductor device and methods of forming same are disclosed having multiple die redistribution layer. After fabrication of semiconductor die on a wafer and prior to singulation from the wafer, adjacent semiconductor die are paired together and a redistribution layer may be formed across the die pair. The redistribution layer may be used to redistribute at least a portion of the bond pads from the first die in the pair to a second die in the pair. One die in each pair will be a working die and the other die in each pair will be a dummy die. The function of the integrated circuit beneath the redistribution layer on the dummy die is at least partially sacrificed. |
申请公布号 |
AT518245(T) |
申请公布日期 |
2011.08.15 |
申请号 |
AT20070869868T |
申请日期 |
2007.12.24 |
申请人 |
SANDISK CORPORATION |
发明人 |
TAKIAR, HEM;BHAGATH, SHRIKAR |
分类号 |
H01L25/065 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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