| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a lead frame substrate for an LED light-emitting device which has a plating surface without resin burrs and resin contamination caused by filling resin, and exhibits a high heat dissipation property and a high optical property, and to provide the lead frame substrate for the LED light-emitting device which is manufactured by using the method. <P>SOLUTION: In the method for manufacturing the lead frame substrate for the LED light-emitting device, silver plating, gold plating, palladium plating or the like is applied to a base plating layer such as Ni (nickel) plating or the like exhibiting high heat resistance and diffusion capability in an electrical connection area for electrical connection with pads and LED chips on the lead frame after etching. Then a protective layer for preventing resin burrs and resin contamination caused by filling resin is applied by plating. After filling with resin, physical polishing such as wet blasting is performed and the protective layer is removed by etching. The plating surface without resin contamination under the protective layer is recreated. <P>COPYRIGHT: (C)2011,JPO&INPIT |
