| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board wherein the wiring board can be manufactured efficiently while preventing a formed conductor pattern from having poor electrical conductivity, and to provide a highly reliable wiring board. <P>SOLUTION: The method of manufacturing a wiring board includes: a step of forming a plurality of ceramic moldings consisting of a material containing a ceramic material, glass powder and an organic matter, a step of discharging conductor pattern formation ink where metal particles are dispersed into aqueous dispersant by a droplet discharge method and forming a conductor pattern precursor on the ceramic moldings; a step of laminating a plurality of ceramic moldings on which the conductor pattern is formed thus obtaining a laminate; and a heating step of heating the laminate. The average rate of a temperature rise is changed in the range of 250-350°C inclusive during the heating step after heating is started before the degreasing completion temperature is reached, and the average rate of the temperature rise after change is higher than that before change. <P>COPYRIGHT: (C)2011,JPO&INPIT |
