发明名称 CIRCUIT CONNECTION FILM
摘要 PROBLEM TO BE SOLVED: To provide a circuit connection method for electrically connecting a fine circuit using an anisotropic conductive adhesive, the method being excellent in continuity between connection electrodes with a minute area and hardly causing an insulation failure such as a short circuit or an ion migration in a space between fine adjacent electrodes, and a connection structure obtained thereby. SOLUTION: In an anisotropic conductive adhesive film primarily containing conductive particles and an insulation adhesive, a drift velocity of the insulation adhesive in the space between the adjacent electrodes at the time of connection is higher than the drift velocity of the insulation adhesive between connection electrodes, and the conductive particles are fixed with a fixing resin with such a fixing strength that the conductive particles flow following the drift velocity of the insulation adhesive in the space between the adjacent electrodes, while fluidity of the conductive particles is suppressed against the drift velocity of the insulation adhesive between the connection electrodes. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011155009(A) 申请公布日期 2011.08.11
申请号 JP20110034465 申请日期 2011.02.21
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 SHIMADA HITOSHI;USUI TAKETOSHI
分类号 H01R11/01;H01B1/22;H01B5/16;H01L21/60 主分类号 H01R11/01
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