POWER MODULE HAVING A CIRCUIT ASSEMBLY, ELECTRICAL/ELECTRONIC CIRCUIT ASSEMBLY, METHOD FOR PRODUCING A POWER MODULE

摘要

The invention relates to a power module (2) having a circuit assembly (4) which comprises at least one power element (7) arranged on a substrate (5), wherein the circuit assembly (4) is housed at least in regions by a mold housing (16). According to the invention, a heatsink (9), also housed in sections and made of a metal/ceramic composite material (10) and having an increasing ceramic content in the direction of the substrate (5), is allocated to the substrate (5). The invention further relates to a power apparatus (1). Finally, the invention relates to a method for producing a power module.