| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device that can take heat radiation measures and ESD (Electro-Static Discharge) measures, and achieve the reduction in manufacturing cost or the like to be more suitable for practical use. SOLUTION: A semiconductor device 102 is provided on a printed board having a copper foil layer 106 to be connected to GND (ground potential). A heat sink 104 for radiating heat of the semiconductor device is fixed to the printed board by a fixture 105. Then, the fixture 105 is wound with a connecting spring 121, and the heat sink 104 and copper foil layer 106 are electrically connected to each other through the connecting spring 121. COPYRIGHT: (C)2011,JPO&INPIT |
