| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing condition determination method capable of determining a suitable processing condition out of a plurality of processing conditions by grasping deterioration of luminance, the deterioration being caused by each of the plurality of processing conditions, even if there are variations in the luminance inside a substrate surface. <P>SOLUTION: When there is a luminance gradient in a wafer W for a light-emitting device, the luminance of a first light-emitting device 51 which is to be divided by a first processing condition and mean luminance of a second light-emitting device 52 divided by a second processing condition around the first light-emitting device 51, by taking the first light-emitting device 51 as substantially the center are measured; and a processing condition dividing the device having the higher one of either of the luminance of the first light-emitting device 51 and the mean luminance of the second light-emitting device is determined as the processing conditions for a laser processing system 1 that processes the wafer W for light-emitting device. <P>COPYRIGHT: (C)2011,JPO&INPIT |
