发明名称 |
RESIN COMPOSITION AND RESIN CURED PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition giving a uniform resin cured product of high electric insulating performance and thermal conductivity, and excellent in moldability, and to provide the uniform resin cured product of high electric insulating performance and thermal conductivity. SOLUTION: This resin composition of the invention contains a compound having a main chain including a benzazole skeleton, and branch chains bonded to both ends of the main chain and including a polymerizable group in a terminal. The resin cured product of the invention is obtained by polymerizing the resin composition. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011153268(A) |
申请公布日期 |
2011.08.11 |
申请号 |
JP20100017248 |
申请日期 |
2010.01.28 |
申请人 |
MITSUBISHI ELECTRIC CORP;TOKYO INSTITUTE OF TECHNOLOGY |
发明人 |
YASUDA NAOKI;KAKIMOTO MASAAKI;URUSHIBATA HIROAKI;HAYAKAWA TERUAKI;MAEDA RINA;KODAMA TAKASHI |
分类号 |
C08L101/02;C08F2/44;C08F16/28;C08G59/20;H01B3/30;H01B3/40 |
主分类号 |
C08L101/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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