发明名称 RESIN COMPOSITION AND RESIN CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition giving a uniform resin cured product of high electric insulating performance and thermal conductivity, and excellent in moldability, and to provide the uniform resin cured product of high electric insulating performance and thermal conductivity. SOLUTION: This resin composition of the invention contains a compound having a main chain including a benzazole skeleton, and branch chains bonded to both ends of the main chain and including a polymerizable group in a terminal. The resin cured product of the invention is obtained by polymerizing the resin composition. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011153268(A) 申请公布日期 2011.08.11
申请号 JP20100017248 申请日期 2010.01.28
申请人 MITSUBISHI ELECTRIC CORP;TOKYO INSTITUTE OF TECHNOLOGY 发明人 YASUDA NAOKI;KAKIMOTO MASAAKI;URUSHIBATA HIROAKI;HAYAKAWA TERUAKI;MAEDA RINA;KODAMA TAKASHI
分类号 C08L101/02;C08F2/44;C08F16/28;C08G59/20;H01B3/30;H01B3/40 主分类号 C08L101/02
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