发明名称 SILVER TREATMENT AGENT, SILVER TREATMENT METHOD, AND CONDUCTIVE PATTERN FORMING METHOD
摘要 PURPOSE: Silver-treatment agent, a method of treating silver and a method of forming a pattern of a conductor are provided to prevent treatment agent from excessively permeating a silver layer in halogenation since imidazole, 1-, 2- or 4-C, or N atom contains one of imidazole compound with 1~4 Cs of alkyl substituent and 1,2-dialkylimidazole. CONSTITUTION: A method of forming a pattern of a conductor comprises next steps. An etching resist layer is formed on a substrate with a silver layer so that a part of the silver layer is exposed. Silver-treatment agent comprises one of imidazole compound with 1~4 Cs of alkyl substituent and 1,2-dialkylimidazole in imidazole, 1-, 2- or 4-C, or N atom. The silver-treatment agent makes contact with the silver layer exposed from the etching resist of the substrate to change the silver layer to silver halide. Removing agent comprising at least one of complexing agent and acid makes contact with the silver halide to remove the silver halide from the substrate to form a pattern of a conductor.
申请公布号 KR20110091452(A) 申请公布日期 2011.08.11
申请号 KR20110008687 申请日期 2011.01.28
申请人 MEC COMPANY LTD. 发明人 DEGUCHI YUKARI
分类号 C23F1/30;C23F1/02;G02F1/1343;H01L21/308 主分类号 C23F1/30
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