| 摘要 |
<p>In a piezoelectric vibrator in which a piezoelectric vibrating reed is mounted on a mounting portion installed on a surface of the base substrate in a cantilevered state and the piezoelectric vibrating reed is accommodated to be covered by a lid substrate, the resistance of a lead-out electrode for supplying a drive power to the piezoelectric vibrating reed is reduced, thereby preventing degradation of vibrating performance. A first lead-out electrode is formed between a first through-electrode and a mounting portion formed on a base substrate, a conductor film is formed from a bonding member on a bonding surface where the base substrate and a lid substrate are bonded to each other, the first lead-out electrode and the conductor film are electrically connected to each other via the first connection portion in the vicinity of the mounting portion and via the second connection portion in the vicinity of the first through-electrode, thereby reducing the resistance of the first lead-out electrode.</p> |
