Technique for manufacturing an overmolded electronic assembly

摘要

A technique for manufacturing an electronic assembly (300) includes a number of steps. Initially, a backplate (302) with a cavity (319) formed into a first side of the backplate (302) is provided. Next, a substrate (304) with a first side of an integrated circuit (IC) die (306A) mounted to a first side of the substrate (304) is provided. The IC die (306A) is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate (304). The substrate (304) includes a hole (320) approximate an outer edge of the IC die (306A). The first side of the substrate (304) is then positioned in contact with at least a portion of the first side of the backplate (302). The IC die (306A) is positioned within the cavity (319) with a second side of the IC die (306A) in thermal contact with the backplate (302). The substrate (304) and at least a portion of the backplate (302) are overmolded with an overmold material (350), which enters the cavity (319) through the hole to substantially underfill the IC die (306A) and substantially fill an unoccupied portion of the cavity (319).