| 摘要 |
PURPOSE: An LED lamp heat sink and an LED lamp comprising the same are provided to use a resin material coated with a metal layer as a part of composition materials, thereby enabling to make lighter the weight and lower the manufacturing cost since a post processing is unnecessary. CONSTITUTION: An LED lamp is comprised by successively combining an LED PCB substrate assay(30), a divergent lens(20), and a front surface cover(10). An LED lamp heat sink(50) is comprised of a component which is having thermal conductivity of more than 10 W per mK and combined with the LED PCB substrate assay. The component combined with the LED PCB substrate array generates heat and the heat is collected by the LED lamp heat sink. The LED PCB substrate assay is mounted in the bottom surface of a heat absorber. The divergent lens is mounted in the middle surface of the heat absorber. The front surface cover is mounted in the outer front surface of the heat absorber. |
