发明名称 |
Leadless package system having external contacts |
摘要 |
A leadless package system includes: providing a chip carrier having indentations defining a pattern for a protrusion for external contact terminals; placing an external coating layer in the indentations in the chip carrier; layering a conductive layer on top of the external coating layer; depositing an internal coating layer on the conductive layer; patterning the internal coating layer and the conductive layer to define external contact terminals with a T-shape profile; connecting an integrated circuit die to the external contact terminals; encapsulating the integrated circuit die and external contact terminals; and separating the chip carrier from the external coating layer.
|
申请公布号 |
US7993979(B2) |
申请公布日期 |
2011.08.09 |
申请号 |
US20070964567 |
申请日期 |
2007.12.26 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;CHUA LINDA PEI EE;KUAN HEAP HOE |
分类号 |
H05K3/34;H01L21/48;H01L23/28;H01L23/31;H05K3/38 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|